SemiAnalysis: SPHBM4 Transfers the Complex Engineering Burden of AI Chips to the Substrate Layer

Odaily reported that SemiAnalysis posted on X platform, stating that SPHBM4 transfers the complex engineering burden of AI chips. Chip manufacturers will no longer purchase extremely expensive proprietary "silicon interposer + ABF substrate" combinations. Instead, they will completely shift to buying ultra-large, high-layer-count ABF substrates, or adopt glass substrates early when performance requirements are directly pushed to the substrate layer. The substrate boom is just beginning.