封装测试龙头日月光再度调涨封装报价，涨幅最高超20%

Odaily Planet Daily News: According to industry sources, on July 1, ASE Technology Holding, the world's top-ranked OSAT supplier, announced another price hike for its packaging services, with increases reaching up to over 20%.

ASE's latest price adjustments cover various advanced packaging technologies, including Chip-on-Wafer-on-Substrate (CoWoS) and Fan-Out Chip-on-Substrate (FoCoS). (Source: Jinshi)