三星电子公布2nm工艺及AI半导体生态合作计划

Odaily Planet Daily News Samsung Electronics held the SAFE Forum 2026 in Seoul, unveiling its next-generation 2nm process technology, DTCO (Design Technology Co-Optimization) techniques, a high-performance SRAM roadmap, and outlining strategies to expand AI semiconductor ecosystem cooperation in South Korea and advance next-generation foundry technologies. Samsung Electronics stated that it will strengthen communication with customers and partners through the SAFE Forum and enhance its platform role within Korea's system semiconductor industry beyond foundry production. South Korean AI fabless company Rebellions announced that it has developed the REBEL100 NPU based on Samsung Electronics' 4nm foundry process and advanced packaging, and will continue collaboration in the AI semiconductor field moving forward. Samsung Electronics is also participating in the M.AX Alliance led by Korea's Ministry of Trade, Industry and Energy, promoting the development of low-power, high-performance on-device AI semiconductors for automotive, home appliance, robotics, and defense sectors. Additionally, it will continue supporting the MPW (Multi-Project Wafer) program, which helps reduce the initial sample production burden for Korean fabless companies, as well as the K-CHIPS talent cultivation initiative.