Payment service provider Due completes $7.3 million seed round of financing, led by Speedinvest

According to Odaily Planet Daily, payment service provider Due has completed a US$7.3 million seed round of financing, led by Speedinvest, with participation from Semantic Ventures, Fabric Ventures, Strobe Ventures and Polymorphic Capital.

Due is integrating native payment rails, liquidity markets, and blockchain networks into a unified infrastructure.