Expected to at least double, Samsung Electronics to expand HBM4 and HBM4E production next year

Odaily reports that Citrini analyst jukan posted on the X platform stating that Samsung Electronics is expected to at least double its HBM4 and HBM4E output next year compared to this year, and plans to increase the outsourced cleaning volume of glass carriers used for HBM production from 20,000 units per month this year to 50,000 units per month next year.

Samsung Electronics began mass production and shipment of HBM4 in February this year, and in May provided HBM4E 12-layer stacked samples to customers including Nvidia. The industry expects that Samsung Electronics' average monthly wafer input for HBM will increase from approximately 180,000 units this year to approximately 250,000 units next year, and the shipment share of the HBM4 series may rise from about 40% to about 80%.