AMD Plans $5 Billion Bond Offering to Boost AI Infrastructure Investment

Odaily News Chip giant AMD plans to raise up to $5 billion through a four-part bond offering, which, if completed, would become one of the largest bond financings in the company's history.

It is reported that AMD is increasing capital expenditure to address the rapidly growing demand for AI computing. Previously, the company has reached significant cooperation agreements with Anthropic and Microsoft (MSFT), and has committed to providing up to $5 billion in support to Anthropic.

The proceeds from this bond offering will be used for general corporate purposes, including potential debt repayment. As of now, AMD has approximately $875 million in bonds maturing next month.

The market believes that AMD's recent continuous expansion of its AI chip and computing infrastructure layout, with debt financing providing financial support for the company to further invest in its AI business, expand its supply chain, and drive strategic cooperation.