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Samsung Electronics Considers Outsourcing Backend Design for Google's 2nm TPU I/O Die

2026-07-15 09:33

Odaily News: Citrini analyst jukan posted on X, stating that Samsung Electronics is considering outsourcing the backend design work for the I/O Die of Google's 10th generation 2nm TPU "Icefish," and has already inquired with design solution partners about requirements. This TPU is used to run Google's AI models, including Gemini. Google is reportedly co-designing this chip with MediaTek, with mass production planned as early as 2028. The TPU consists of a compute processor and an I/O Die; the compute processor is expected to be manufactured by TSMC using a 1.4nm process, while the I/O Die will be manufactured by Samsung Electronics using a 2nm process. Recently, Samsung Electronics is said to have secured Anthropic and DeepX as 2nm customers, in addition to Google and Tesla.

ADTechnology, Gaonchips, and Alphachips have been mentioned as potential outsourcing contractors. Among them, ADTechnology is focusing on a 2nm CPU project "ADP620," targeting an annual revenue exceeding 1 trillion KRW between 2028 and 2029. Gaonchips is preparing to participate in the "K-On-Device AI" project, which has a budget of approximately 800 billion KRW from the Ministry of Trade, Industry and Energy. Alphachips is reportedly viewing the Google TPU project as a growth driver and is becoming more actively involved.