SemiAnalysis: SPHBM4 Transfers the Complex Engineering Burden of AI Chips to the Substrate Layer
2026-07-03 13:32
Odaily Planet Daily News, SemiAnalysis posted on platform X, stating that SPHBM4 shifts the complex engineering burden of AI chips. Chip manufacturers will no longer purchase extremely expensive, proprietary "silicon interposer + ABF substrate" combinations. Instead, they will completely shift to buying ultra-large, high-layer-count ABF substrates, or adopt glass substrates prematurely if performance requirements are directly pushed to the substrate layer. The substrate boom is just beginning.
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