Korean media: Samsung Electronics and SK Hynix may delay the introduction of next-generation HBM hybrid bonding technology

According to Korean media reports, Samsung Electronics and SK Hynix are reassessing the timeline for adopting hybrid bonding technology in next-generation High Bandwidth Memory (HBM). Due to a decreased demand for thickness reduction and heat dissipation performance improvements in HBM, the market expects the technology's introduction to be delayed further than previously anticipated. Meanwhile, the two companies are respectively developing new heat dissipation solutions such as HPB and iHBM, which are planned for application in HBM5 products. However, industry insiders believe that as the number of HBM I/Os continues to increase in the future, hybrid bonding will still remain an important long-term technological path.