SK hynix Expands Outsourcing of Flip-Chip Packaging for Memory Semiconductors

Odaily News: SK hynix is expanding its outsourcing of flip-chip packaging for memory semiconductors. Following OSAT (outsourced semiconductor assembly and test) supplier A-PROTECH, SK hynix has begun outsourcing more business to WINPAC, marking the two companies' first collaboration in four years.

SK hynix plans to assign packaging orders for some DDR4 and DDR5 DRAM memory chips to Winpac. Winpac has completed equipment commissioning and other production line preparations at its packaging plant in the P cluster, and has now entered the mass production phase. The cluster is responsible for packaging high-performance products such as DRAM, NAND flash, and eUFS embedded universal flash storage, with monthly capacity increased from 44 million units to 50 million units. (Jinshi)