Samsung Electronics plans to build 4 new semiconductor wafer fabs in South Korea by 2030

Odaily News: South Korean semiconductor company Samsung Electronics is refining its investment plan for a large-scale semiconductor production base in Korea, planning to build four new wafer fabs by 2030, and has shared relevant plans with key partners.

Samsung Electronics plans to build Pyeongtaek P5, P6, one wafer fab at the Yongin Namsa-eup semiconductor cluster, and one new wafer fab in Gwangju. SK Hynix is expected to build Y1 and Y2 at the Yongin Wonsam-myeon semiconductor cluster and one new wafer fab in Gwangju. The total number of new wafer fabs built by the two companies from this year to 2030 will reach seven.

Samsung Electronics and SK Hynix announced on the 29th of last month a semiconductor equipment investment roadmap totaling 3.2 quadrillion Korean won, excluding investment costs for AI data centers. Samsung Electronics has advanced its target for completing the Yongin wafer fab from 2047 to 2040, and SK Hynix has advanced its target from 2045 to 2033.

An industry insider in semiconductor equipment stated that Samsung Electronics recently inquired with partners about their willingness for additional local investment, based on the premise of building a wafer fab in Gwangju by 2030. However, considering current production capacity and Gwangju's infrastructure, it is still difficult to confirm the feasibility.