Samsung Electronics plans to build a new DRAM factory in Giheung, with an estimated monthly production capacity of 100,000 wafers

Odaily Planet Daily News: Citrini analyst jukan posted on the X platform stating that Samsung Electronics plans to build a new DRAM wafer fab in its Giheung campus, converting a site originally designated for an R&D center into a memory production facility. The facility is expected to have a monthly production capacity of approximately 100,000 wafers, with total investment projected to reach tens of trillions of Korean won. Samsung Electronics has formed an internal team to advance the construction of the new wafer fab, with initial construction potentially starting as early as the third quarter. Counterpoint Research forecasts that, driven by rising product prices, global DRAM market revenue will grow from $150 billion this year to as much as $210 billion. Samsung Electronics is also installing a new production line at the Pyeongtaek P4 plant with a monthly capacity of 100,000 wafers, capable of producing DRAM for the sixth-generation HBM, or HBM4, and plans to build a wafer fab at the next-generation semiconductor cluster in Yongin, Gyeonggi Province, targeting initial production in 2029. Additionally, the company is advancing the construction of two advanced semiconductor wafer fabs at the Gwangju semiconductor cluster in South Jeolla Province, with a total investment of 400 trillion Korean won.