SemiAnalysis: SPHBM4 Shifts the Complex Engineering Burden of AI Chips to the Substrate Layer

Odaily reported that SemiAnalysis stated on the X platform that SPHBM4 shifts the complex engineering burden of AI chips. Chip manufacturers will no longer purchase extremely expensive proprietary "silicon interposer + ABF substrate" combinations. Instead, they will completely shift to buying oversized, high-layer-count ABF substrates, or adopt glass substrates early in cases where performance demands are pushed directly to the substrate layer. The substrate boom has just begun.