TSMC CEO: CoPoS Advanced Packaging Pilot Line Now Operational, Production Expected to See Significant Increase in Two to Three Years

Odaily News According to tech analyst @jukan05, the CEO of TSMC stated that the company's CoPoS advanced packaging technology is already running on a pilot production line, and production volume is expected to increase significantly in the next two to three years. He also mentioned that TSMC is expanding mature process wafer capacity, including a fab in Japan to meet CMOS image sensor demand, and a fab in Germany to support automotive and industrial needs. At the same time, the company has no intention of significantly raising prices like the memory semiconductor industry, but will continue to focus on long-term, sustainable growth rather than short-term price increases.