Chip manufacturer Tower Semiconductor to invest $3 billion in Japan

Odaily Planet Daily News Chip manufacturer Tower Semiconductor announced on July 14 local time that it will invest $3 billion to strengthen chip manufacturing in Japan, including $1 billion in subsidies from the Japanese government. The statement stated that the first phase will significantly increase the production capacity of 300mm silicon photonic devices, which is expected to be fully operational in the fourth quarter of 2027. This phase includes the transformation of the original Fab 6 facility to equip it with 300mm silicon photonic device production capacity and advanced packaging capabilities. The second phase will commence simultaneously with the first phase, including the construction of a new 300mm lithography manufacturing plant adjacent to the Fab 7 facility.