封装测试龙头日月光再度调涨封装报价，涨幅最高超20%
2026-07-01 15:58
Odaily Planet Daily News According to industry sources, on July 1, ASE Technology Holding, the world's leading OSAT (Outsourced Semiconductor Assembly and Test) supplier, announced another price increase for its packaging services, with some increases exceeding 20%.
This round of price hikes covers various advanced packaging technologies, including Chip-on-Wafer-on-Substrate (CoWoS) and Fan-out Chip-on-Substrate (FoCoS). (Jin Shi)
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