SemiAnalysis: SPHBM4 Shifts the Complex Engineering Burden of AI Chips to the Substrate Layer
2026-07-03 13:32
Odaily reported that SemiAnalysis posted on X platform, stating that SPHBM4 shifts the complex engineering burden of AI chips. Chip manufacturers will no longer purchase extremely expensive proprietary "silicon interposer + ABF substrate" combinations. Instead, they will completely switch to buying ultra-large, high-layer count ABF substrates, or adopt glass substrates earlier in cases where performance demands are directly pushed to the substrate layer. The substrate boom has just begun.
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