封装测试龙头日月光再度调涨封装报价，涨幅最高超20%
2026-07-01 15:58
Odaily Planet Daily News: According to industry sources, on July 1st, ASE Technology Holding, the world's leading OSAT (Outsourced Semiconductor Assembly and Test) supplier, announced another price hike for its packaging services, with the highest increase exceeding 20%.
ASE's latest price adjustments cover various advanced packaging technologies, including CoWoS (Chip-on-Wafer-on-Substrate) and FoCoS (Fan-Out Chip-on-Substrate). (Jin Shi)
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