Micron Plans Major HBM Expansion This Year, Capacity Expected to Double

Odaily News: Micron plans to make large-scale equipment investments before the end of this year to boost supply capacity for its latest-generation HBM product, the HBM4 12-layer offering. The move aims to close the gap with Samsung Electronics and SK Hynix in HBM production capacity, thereby increasing its market share. Micron plans to add up to 60,000 wafers per month of HBM capacity (on a wafer basis) by the end of this year. Last year, Micron's HBM output stood at roughly 40,000 to 50,000 wafers per month, which means Micron's HBM capacity will more than double from a year earlier.

An industry insider familiar with the matter said: "Micron is undertaking massive equipment investments to rapidly ramp up HBM4 production capacity. By the end of this year, Micron is expected to hold approximately 100,000 wafers per month of HBM capacity." (South Korea's ETNews)