SK Hynix launches construction of $4 billion advanced memory packaging plant in the U.S.

Odaily reported that SK Hynix has begun construction of a $4 billion memory hub in Indiana, U.S., and plans to commence mass production of next-generation HBM4E chips at the Indiana facility in the second half of 2029. SK Hynix's CEO anticipates that Indiana will become a core production base for high-bandwidth memory (HBM) in the United States.