Chip manufacturer Tower Semiconductor will invest $3 billion in Japan

Odaily reported that chip manufacturer Tower Semiconductor announced on July 14 local time that it will invest $3 billion to strengthen chip manufacturing in Japan, which includes a $1 billion subsidy from the Japanese government. The statement noted that the first phase will significantly increase production capacity for 300mm silicon photonics devices, with full production expected by the fourth quarter of 2027. This phase includes retrofitting the former Fab 6 facility to equip it with 300mm silicon photonics device production capacity and advanced packaging capabilities. The second phase will begin simultaneously with the first phase and includes the construction of a new 300mm lithography manufacturing plant next to the Fab 7 facility.