韩媒：三星电子与SK海力士或推迟下一代HBM混合键合技术导入

According to Korean media reports, Samsung Electronics and SK Hynix are reassessing the timeline for adopting Hybrid Bonding technology in next-generation High Bandwidth Memory (HBM). As demand for thickness reduction and heat dissipation performance improvement in HBM has declined, the market expects the introduction of this technology to be further delayed compared to earlier expectations. Meanwhile, both companies are developing new thermal solutions such as HPB and iHBM, which are planned for application in HBM5 products. However, industry insiders believe that as the number of HBM I/Os continues to increase in the future, Hybrid Bonding will remain an important long-term technological pathway.