美光计划年内大幅扩产HBM，产能有望翻倍

The Odaily Planet Daily reports that Micron plans to make large-scale equipment investments before the end of the year to enhance the supply capacity of its latest-generation HBM—the HBM4 12-layer product. This move aims to close the gap with Samsung Electronics and SK Hynix in HBM production capacity, thereby increasing its market share. Micron plans to add up to 60,000 wafers per month of HBM capacity (based on wafers) by the end of this year. Last year, Micron's HBM output was approximately 40,000 to 50,000 wafers per month; based on this, Micron's HBM capacity will be more than double that of last year.

An industry insider familiar with the matter stated: "Micron is undertaking large-scale equipment investments to rapidly boost HBM4 production capabilities. It is expected that by the end of this year, Micron will have an HBM capacity of approximately 100,000 wafers per month." (South Korea's ETNews)