chip manufacturer Tower Semiconductor will invest $3 billion in Japan

Odaily Planet Daily News: Chip manufacturer Tower Semiconductor announced on July 14 local time that it will invest $3 billion to strengthen its chip manufacturing in Japan, including a $1 billion subsidy from the Japanese government. The statement said the first phase will significantly increase the production capacity of 300mm silicon photonics devices, with full production expected to begin in the fourth quarter of 2027. This phase includes transforming the former Fab 6 plant to have 300mm silicon photonics device production capacity and advanced packaging capabilities. The second phase will start simultaneously with the first phase, including building a new 300mm lithography manufacturing plant next to the Fab 7 plant.