台积电CEO：CoPoS先进封装已运行试产线，未来两三年产量预计显著增加

Odaily Planet Daily reported, according to tech analyst @jukan05, that TSMC CEO stated the company's CoPoS advanced packaging technology is already running on a trial production line, and production volume is expected to increase significantly in the next two to three years. He also mentioned that TSMC is expanding mature process wafer capacity, including a fab in Japan to meet CMOS image sensor demand, and a fab in Germany to support automotive and industrial needs. Meanwhile, the company has no intention of significantly raising prices like the memory semiconductor industry, but will continue to focus on long-term, sustainable growth rather than short-term price increases.