Samsung Electronics plans to build 4 new semiconductor wafer fabs in South Korea by 2030

Odaily Planet Daily News: South Korean semiconductor company Samsung Electronics is refining its investment plan for a large-scale semiconductor production base in South Korea. It plans to build 4 new wafer fabs by 2030 and has shared relevant plans with key partners.

Samsung Electronics plans to build Pyeongtaek P5, P6, one wafer fab in the Yongin Namsa-eup semiconductor cluster, and one new wafer fab in Gwangju. SK Hynix is expected to build Y1 and Y2 in the Yongin Wonsam-myeon semiconductor cluster and one new wafer fab in Gwangju. The total number of new wafer fabs built by the two companies from this year to 2030 will reach 7.

On the 29th of last month, Samsung Electronics and SK Hynix announced a total semiconductor equipment investment roadmap of 3200 trillion won, excluding AI data center investment costs. Samsung Electronics has advanced the completion target for the Yongin wafer fab from 2047 to 2040, while SK Hynix has moved it from 2045 to 2033.

A source in the semiconductor equipment industry stated that Samsung Electronics recently, based on the premise of building a wafer fab in Gwangju by 2030, asked partners if they are interested in making additional investments locally. However, considering current production capacity and Gwangju's infrastructure, it is still difficult to confirm the feasibility.